A global semiconductor company, Texas Instruments (TI) innovates through manufacturing, design and sales operations in more than 30 countries. To date, TI has shipped more than six billion ARM® core-based devices worldwide for a variety of applications such as: safety critical automotive, wireless handsets and base stations, imaging, video and dual core digital signal processors (DSP). TI provides a breadth of silicon, software and support expertise that spans the broadest range of solutions from leading DSPs and OMAP™ applications processors to high performance analog and broad microcontroller solutions. For more information, go to www.ti.com.
处理器家族
Sitara™ ARM® MPU Product Platform
Sitara™ high performance, ARM-based microprocessors are comprised of the ARM® Cortex™-A8 or ARM9™ based embedded microprocessors with speeds ranging from 200 MHz to beyond 1GHz in future devices.
分组内容: AM1x ARM9™ | AM37x ARM Cortex-A8 | AM389x ARM Cortex-A8 | AM35x ARM Cortex-A8 |
C6-Integra™ DSP+ARM®
The C6-Integra™ DSP + ARM® platform of processors include a high-performance line, featuring the C6A816x generation of processors as well as a value line, featuring TI low-power OMAP-L1x application processors.
分组内容: TMS320C6A816x | OMAP-L1x |
DLPC100
The DLPC100 performs all the image processing and control, along with DMD data formatting, for driving a 0.17 HVGA DMD (DLP1700).
Stellaris MCU系列
Stellaris MCU 和 ARM Cortex-M3 使开发人员能够直接使用业界最强大的开发工具、软件和知识系统。已迁移至 Stellaris 的开发人员将受益于强大的工具、小型代码封装和出色的性能。
分组内容: LM3S328 | LM3S601 | LM3S610 | LM3S611 | LM3S612 | LM3S613 | LM3S615 | LM3S628 | LM3S801 | LM3S811 | LM3S812 | LM3S815 | LM3S828 | LM3S101 | LM3S102 | LM3S316 | LM3S315 | LM3S301 | LM3S310 | LM3S317 | LM3S617 | LM3S618 | LM3S817 | LM3S818 | LM3S6965 | LM3S6952 | LM3S6938 | LM3S6730 | LM3S6637 | LM3S6633 | LM3S6610 | LM3S6432 | LM3S6422 | LM3S6420 | LM3S6110 | LM3S6100 | LM3S2965 | LM3S2948 | LM3S2950 | LM3S2939 | LM3S2739 | LM3S2730 | LM3S2651 | LM3S2637 | LM3S2620 | LM3S2533 | LM3S2432 | LM3S2412 | LM3S2410 | LM3S2139 | LM3S2110 | LM3S6537 | LM3S6753 | LM3S6950 | LM3S1937 | LM3S1958 | LM3S1960 | LM3S1968 | LM3S1850 | LM3S1751 | LM3S1620 | LM3S1635 | LM3S1637 | LM3S1512 | LM3S1538 | LM3S1435 | LM3S1439 | LM3S1332 | LM3S1110 | LM3S1133 | LM3S1138 | LM3S1150 | LM3S1162 | LM3S1165 | LM3S8930 | LM3S8933 | LM3S8938 | LM3S8962 | LM3S8970 | LM3S8730 | LM3S8733 | LM3S8738 | LM3S8630 | LM3S8530 | LM3S8538 | LM3S300 | LM3S308 | LM3S600 | LM3S608 | LM3S800 | LM3S808 | LM3S1601 | LM3S1608 | LM3S1911 | LM3S1918 | LM3S2601 | LM3S2608 | LM3S2911 | LM3S2918 | LM3S6611 | LM3S6618 | LM3S6911 | LM3S6918 | LM3S8971 | LM3S1607 | LM3S3749 | LM3S3748 | LM3S3739 | LM3S3651 | LM3S5762 | LM3S5752 | LM3S5749 | LM3S5747 | LM3S5739 | LM3S5737 | LM3S5732 | LM3S5662 | LM3S5652 | LM3S5632 | LM3S1627 | LM3S1626 | LM3S1776 | LM3S2276 | LM3S2616 | LM3S2671 | LM3S2678 | LM3S2776 | LM3S2793 | LM3S2B93 | LM3S5791 | LM3S5B91 | LM3S9790 | LM3S9792 | LM3S9B90 | LM3S9B92 | LM3S9B95 | LM3S9B96 |
TMS320C2000™ Real-time control MCUs
C2000™ devices are 32 bit microcontrollers with high performanceintegrated peripherals designed for real-time control applications. Itsmath-optimized core gives designers the means to improve systemefficiency, reliability, and flexibility. Powerful integratedperipherals make C2000 devices the perfect single-chip control solution.C2000´s development tools strategy and controlSUITE™ software create anopen platform with the goal of maximizing usability and minimizingdevelopment time.
分组内容: TMS320F2802x/2803x | TMS320F280XX | TMS320F28332 | TMS320C2834X Delfino | TMS320R2811 | TMS320F2823X | TMS320X2810 | TMS320X2801 | TMS320F28044 | TMS320LX2402A | TMS320LX2401A | TMS320F243 |
OMAP35X Applications Processor
OMAP applications processors offer a variety of combinations of the Cortex-A8 core, multimedia- rich peripherals, OpenGL® ES 2.0 compatible graphics engine, video accelerators and TMS320C64x+ DSP core. The modular and extensible OMAP35x Evaluation Module (EVM) provides all the components needed to start developing today on the OMAP3503 processor including an OMAP3503 Linux board support package based on the 2.6.22 kernel.
分组内容: OMAP3515/03 | OMAP3530/25 |
MSP430 Ultra-Low Power Microcontrollers
The MSP430 platform of ultra-low-power 16-bit RISC mixed-signal processors from TI provides the ultimate solution for battery-powered measurement applications.
分组内容: MSP430F543x/541x | MSP430xW42x | MSP430xG461x | MSP430FG43x | MSP430FE42x | MSP430F43x/43x1/44x | MSP430F42x0 | MSP430F42x | MSP430x41x | PMS430x32xx | MSP430x31x | MSP430x241x/261x | MSP430F23x/24x(1)/2410 | MSP430F23x0 | MSP430F22x2/4 | MSP430F21x1 | MSP430F20xx | MSP430x11x | MSP430F15x/16x/161x | MSP430F13x/14x/14x1 | MSP430F11x2/12x2 | MSP430x12x | MSP430F11x1A | MSP430F47x3/F47x4 | MSP430G2xx Value Series |
DaVinci™ Digital Media Processors
Accelerate Development of Your Digital Video Application with DaVinci™ Technology
Optimized for digital video systems, the DaVinci processor portfolio consists of scalable, programmable processors ranging from affordable, targeted ARM9 only solutions to full-featured Digital Signal Processor (DSP)-based SoCs. These processors offer a variety of video encoding and decoding capabilities with accelerators, peripherals, support for multimedia codecs and application programming interfaces (APIs). These integrated components are the industry’s first complete offering allowing for the development of a complete spectrum of digital video applications.
分组内容: TMS320DM37x SOC | TMS320DM355 | TMS320DM365 | TMS320DM816x | TMS320DM814x |
开发工具
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Bluetooth v2.1 + EDR Transceiver with Integrated Antenna
The CC2560-PAN1325/15 is a highly-integrated class 2 HCI module with increased output power capabilities offered by Panasonic using TI’s CC2560 Bluetooth 2.1+ EDR Transceiver. [more]
OpenLink open source Wi-Fi and Bluetooth daughter card for AM18X and OMAPL13x EVMs
The OpenLink open source Wi-Fi and BlueTooth (AM180x Only) daughter card for AM180x and OMAPL13x evaluation modules (EVMs) is a combo wireless connectivity add-on card, based on the LS Research TiWi module with Texas Instruments WiLink 6.0 (WL1271) solution. [more]
AM18x evaluation module with Wi-Fi
The Zoom AM18x Sitara™ ARM9™ evaluation module (EVM) is a full-featured application development kit that is bundled with WiLink™ 6.0 (WL1271) solution with OpenLink™ open source Bluetooth® and Wi-Fi™ connectivity. [more]
ANT + Bluetooth Health and Fitness Aggregator Kit
TI is offering the first wireless, single-chip solution with dual-mode ANT and Bluetooth connectivity - the CC2567 device. This solution wirelessly connects 13 million ANT-based devices to the more than 3 billion Bluetooth endpoint devices used by people every day, creating new market opportunities for companies building ANT products and Bluetooth products alike. [more]
MindTree EtherMind™ Bluetooth® Stack and SDK
MindTree´s EtherMind Bluetooth® SDK provides a platform for end system designers to quickly evaluate EtherMind Bluetooth Software Protocol Stack and Profiles, and implement applications using it. The SDK is available for TI MSP430BT5190 processor. [more]
PAN1323 Bluetooth Evaluation Module Kit
The PAN1323 Evaluation Module Kit (kit) is a highly versatile, advanced TI Bluetooth ® development tool. The kit, when coupled with 2 MSP430F5438A Experimenter boards, enables early software and hardware prototyping capabilities for wireless embedded applications. [more]
AM335x Evaluation Module
The AM335x Evaluation Module (EVM) enables developers to immediately start evaluating AM335x processors (AM3352, AM3354, AM3356, AM3358) and begin building applications such as portable navigation, portable gaming and home/building automation, among others. [more]
CC3000 FRAM Evaluation Module Kit
The CC3000 FRAM Evaluation Module Kit is a full turn-key TI Wi-Fi evaluation and demonstration tool for the MSP430 FRAM MCUs and TI´s Simplelink Wi-Fi that includes all of the necessary hardware and software to get started quickly [more]