• Supply voltage:
  - Standard products, (A) grade products: VDD = 1.8 to 5.5 V
  - (A2) grade products: VDD = 2.7 to 5.5 V
• Max. frequency: 20 MHz
• ROM capacities: 8 KB to 32 KB flash memory
• RAM capacities: 512 bytes to 1 KB
• 30-pin plastic SSOP and 36-pin plastic FLGA package
• Minimum instruction execution time can be changed from high speed (0.1 µs: @ 20 MHz operation with highspeedsystem clock) to ultra low-speed (122 µs: @ 32.768 kHz operation with subsystem clock)
• General-purpose register: 8 bits x 32 registers (8 bits x 8 registers x 4 banks)
• On-chip single-power-supply flash memory
• Self-programming (with boot swap function)
• On-chip debug function (µPD78F050xD and µPD78F050xDA only)
• On-chip power-on-clear (POC) circuit and low-voltage detector (LVI)
• On-chip multiplier/divider (16 bits x 16 bits, 32 bits/16 bits)
• Key interrupt function
• Clock output/buzzer output controller
• I/O ports: 23 / N-ch open drain (6 V tolerance): 2
• Timers:
  - 16-bit: 1 channel
  - 8-bit: 4 channels
  - Watchdog: 1 channel
• Serial interface:
  - UART/3-wire CSI: 1 channel
  - UART supporting LIN-bus: 1 channel
  - I2C bus: 1 channel
• On-chip 10-bit resolution A/D converter (AVREF = 2.3 to 5.5 V): 4 chennels
• Operating ambient temperature
  - Standard products, (A) grade products: TA = -40 to +85°C
  - (A2) grade products: TA = -40 to +125°C