您现在的位置是:首页 > 厂商 > Freescale Semiconductor > Kinetis K30
Kinetis K30 处理器
  列清单与比较        
  部件型号 家族 制造商 内核变量 频率 Flash/ROM 封装
 PK30X256VMD100  Freescale Kinetis  Freescale Semiconductor  ARM Cortex-M4  100MHz  524288  144MAP
 PK30X256VLQ100  Freescale Kinetis  Freescale Semiconductor  ARM Cortex-M4  100MHz  262144  LQFP144
 PK30N512VMD100  Freescale Kinetis  Freescale Semiconductor  ARM Cortex-M4  100MHz  524288  144MAP
 PK30N512VLQ100  Freescale Kinetis  Freescale Semiconductor  ARM Cortex-M4  100MHz  524288  LQFP144
 PK30N512VLL100  Freescale Kinetis  Freescale Semiconductor  ARM Cortex-M4  100MHz  524288  LQFP100
 MK30DX256ZVLQ10  Freescale Kinetis  Freescale Semiconductor  ARM Cortex-M4  100MHz  524288  LQFP144
 MK30DN512ZVLQ10R  Freescale Kinetis  Freescale Semiconductor  ARM Cortex-M4  100MHz  524288  LQFP144
 MK30DN512ZVLQ10  Freescale Kinetis  Freescale Semiconductor  ARM Cortex-M4  100MHz  524288  LQFP144
  

The Kinetis K30 MCU family is pin, peripheral and software compatible with the K10 MCU family and adds a flexible low-power segment LCD controller with support for up to 320 segments. Devices start from 64 KB of flash in 64QFN packages extending up to 512 KB in a 144MAPBGA package with a rich suite of analog, communication, timing and control peripherals.

Key Features: 

Ultra Low-Power

  • 10 low-power modes with power and clock gating for optimal peripheral activity and recovery times.  Stop currents of <500 nA, run currents of <200 μA/MHz, 4 μs wake-up from Stop mode
  • Full flash programming and analog peripheral operation down to 1.71V for extended battery life
  • Low-leakage wake-up unit with up to eight internal modules and sixteen pins as wake-up  sources in low-leakage stop (LLS)/very low-leakage stop (VLLS) modes
  • Low-power timer for continual system operation in reduced power state

Flash, SRAM and FlexMemory

  • 32 KB - 1 MB flash. Fast access, high reliability with 4-level security protection.
  • 8 KB - 128 KB of SRAM
  •  FlexMemory: 32 bytes - 16 KB of user-segmentable byte write/erase EEPROM for data tables/system data. EEPROMwith over 10M cycles and flash with 100 μsec write time (brownouts without data loss or corruption). No user orsystem intervention to complete programming and erase functions and full operation down to 1.71V. In addition,FlexNVM from 32 KB - 512 KB for extra program code, data or EEPROM backup.

Mixed-Signal Capability

  • Up to two high-speed 16-bit ADCs with configurable resolution. Single or differential output  mode operation for improved noise rejection. 500 ns conversion time achievable with  programmable delay block triggering
  • Up to two 12-bit DACs for analog waveform generation for audio applications
  • Up to three high-speed comparators providing fast and accurate motor over-current  protection by driving PWMs to a safe state
  • Up to two programmable gain amplifiers with x64 gain for small amplitude signal  conversion
  • Accurate on-chip voltage reference eliminates need foraccurate external voltage  reference IC reducing overall system cost

Performance

  • ARM Cortex-M4 core + DSP. 50 - 120 MHz, single cycle MAC, single instruction multiple  data (SIMD) extensions, optional single precision floating point unit
  • Up to 32-channel DMA for peripheral and memory servicing with reduced CPU loading  and faster system throughput
  • Cross bar switch enables concurrent multi-master bus accesses, increasing bus  bandwidth
  • Up to 16 KB of instruction/data cache for optimized bus bandwidth and flash execution  performance
  • Independent flash banks allowing concurrent code execution and firmware updating with  no performance degradation or complex coding routines.

Timing and Control

  • Up to four FlexTimers with a total of 20 channels. Hardware dead-time insertion and  quadrature decoding for motor control
  • Carrier modulator timer for infrared waveform generation in remote control applications
  • Four-channel 32-bit periodic interrupt timer provides time base for RTOS task scheduler  or trigger source for ADC conversion and programmable delay block

Human-Machine Interface

  • Xtrinsic low-power touch-sensing interface with up to 16 inputs. Operates in all  low-power modes (minimum current adder when enabled). Hardware implementation  avoids software polling method. High sensitivity level allows use of overlay surfaces up  to 5 mm thick.

Connectivity and Communications

  • Up to six UARTs, with IrDA support including one UART with ISO7816 smart card  support. Variety of data size, format and transmission/reception settings supported for multiple industrial communication protocols
  • Inter-IC Sound (I2S) serial interface for audio system interfacing
  • Up to two CAN modules for industrial network bridging
  • Up to three DSPI and two I2C

Reliability, Safety and Security

  • Memory protection unit provides memory protection for all masters on the cross bar  switch, increasing software reliability
  • Cyclic redundancy check engine validates memory contents and communication data,  increasing system reliability
  • Independent-clocked COP guards against clock skew or code runaway for fail-safe  applications such as the IEC 60730 safety standard for household appliances
  • External watchdog monitor drives output pin to safe state external components if  watchdog event occurs

External Peripheral Support

  • FlexBus external bus interface provides interface options to memories and peripherals  such as graphics displays.Supports up to 6 chip selects.
  • Secure digital host controller supports SD, SDIO, MMC or CEATA cards for in-application  software upgrades, media files or adding Wi-Fi support
  • NAND flash controller supports up to 32-bit ECC current and future NAND types. ECC  management handled in hardware, minimizing software overhead.