The following product brief applies to Panasonic’s Bluetooth module, series number: PAN1325 and PAN1315. The Bluetooth chip used is the CC2560 from Texas Instruments.

The CC2560-PAN1325/15 is a highly-integrated class 2 HCI module with increased output power capabilities offered by Panasonic using TI’s CC2560 Bluetooth 2.1+ EDR Transceiver. Based on TI’s 7th generation Bluetooth technology, the solution provides best-in-class Bluetooth RF performance of +10dBm typical transmit power and -93dBm typical receiver sensitivity. This solution is provided as a module to help customers reduce development time, lower manufacturing costs, save board space, ease certification, and minimize RF expertise required.

Features

• Fully Qualified Bluetooth v2.1 + Enhanced Data Rate (EDR)
• Data Rate up to 2.1 Mbps
• Best-In-Class Bluetooth RF Performance (Tx Power, Rx Sensitivity, Blocking)
• +10 dBm Typical Tx Power with Transmit Power Control
• –93 dBm Typical Receiver Sensitivity
• Support for Bluetooth Power Saving Modes (Sniff, Hold)
• Low Power Scan Method for Page and Inquiry Scans at 1/3rd Normal Power
• Fast Algorithm for Both ACL and eSCO
• Host Controlled Interface (HCI) Supports Three and Four Wire UART Transport
• with Rates of up to 4Mbps
• Hardware and Software Pre-integration with TI’s MSP430 Ultra Low-Power
• Microcontroller and Stellaris ARM Cortex-M3
• Dimensions: 9 mm x 9.5 mm x 1.8 mm (CC2560-PAN1325, Integrated Antenna);
• 6.5 mm × 9.5 mm × 1.8 mm
• (CC2560-PAN1315, Without Antenna)
• Bluetooth, FCC, CE, IC Certified
• Operating Temperature Range: –20°C to 70°C

APPLICATIONS

• Cable Rplacement
• Wireless Sensors
• Medical Devices
• Computer Peripherals
• Industrial Control
• Consumer Devices